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Jetson AGX Orin Developer Kit

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Jetson AGX Orin Developer Kit

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The NVIDIA® Jetson AGX Orin™ Developer Kit makes it easy to get started with the Jetson AGX Orin module. Compact size, lots of connectors, and up to 275 TOPS of AI performance make this developer kit perfect for prototyping advanced AI-powered robots and other autonomous machines.

Jetson AGX Orin features an NVIDIA Ampere architecture GPU together with next-generation deep learning and vision accelerators, and its high-speed IO and fast memory bandwidth can feed multiple concurrent AI application pipelines. This means you can develop solutions using your largest and most complex AI models to solve problems such as natural language understanding, 3D perception, and multi-sensor fusion.

NVIDIA JetPack™ SDK brings the NVIDIA AI software stack to Jetson, along with application development and optimization tools. Software for specific use cases is available, including Isaac™ for robotics and Metropolis for smart cities, and you can save significant time developing your AI solution when you use your datasets with TAO toolkit to fine-tune pretrained AI models from the NGC™ catalog.

Jetson ecosystem partners offer additional AI and system software, developer tools, and custom software development. They can also help with cameras and other sensors, as well as carrier boards and design services for your product.

With the computing capability of more than 8 Jetson AGX Xavier systems in a developer kit that integrates the latest NVIDIA GPU technology with the world’s most advanced deep learning software stack, you’ll have the flexibility to create tomorrow’s AI solution as well as today’s.


Features

  • Most powerful AI computer for energy-efficient autonomous machines: up to 275 TOPS, power configurable between 15W and 60W, supports multiple concurrent AI inference pipelines, plus high-speed interface support for multiple sensors.
  • Giant Leap forward compared to Jetson AGX Xavier: 8 times AI performance in the same compact form-factor, built with new NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 tensor cores, 12-core Arm Cortex-A78AE v8.2 64-bit CPU 3MB L2+6MB L3
  • Supports multiple concurrent AI inference pipelines with onboard 64GB eMMC, 204 GB/s of memory bandwidth, and 32 GB of DRAM.
  • High-speed interface support for multiple sensors: 22 lanes of PCIe Gen4, Gigabit Ethernet, 4 XFI interfaces for 10 Gigabit Ethernet, a Display Port, 16 lanes of MIPI CSI-2, USB3.2 interfaces, and 40-pin header.
  • Support Jetpack 5.0 installs Ubuntu 20.04 and supports entire NVIDIA JetPack™ and use-case-specific software platforms including Isaac for robotics, and Metropolis for smart cities.

  • Specification

    Jetson AGX Orin module

    AI Performance

    275 TOPS (INT8)

    GPU

    NVIDIA Ampere architecture

    with 2048 NVIDIA® CUDA® cores and 64 Tensor Cores

    Max GPU Freq

    1 GHz

    CPU

    12-core Arm® Cortex®-A78AE v8.2 64-bit CPU

    3MB L2 + 6MB L3

    CPU Max Freq

    2 GHz

    DL Accelerator

    2x NVDLA v2.0

    Vision Accelerator

    PVA v2.0

    Memory

    32GB 256-bit LPDDR5

    204.8 GB/s

    Storage

    64GB eMMC 5.1

    CSI Camera

    Up to 6 cameras (16 via virtual channels*)

    16 lanes MIPI CSI-2

    D-PHY 1.2 (up to 40Gbps) | C-PHY 1.1 (up to 164Gbps)

    Video Encode

    2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265)

    Video Decode

    1x 8K30 | 3x 4K60 | 6x 4K30 | 12x 1080p60| 24x 1080p30 (H.265)

    UPHY

    2 x8 (or 1×8 + 2×4), 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint)

    3x USB 3.2

    Single lane UFS

    Networking

    1x GbE

    4x 10GbE

    Display

    1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1

    Other I/O

    4x USB 2.0

    4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs

    Power

    15W | 30W | 60W

    Mechanical

    100mm x 87mm

    699-pin Molex Mirror Mezz Connector

    Integrated Thermal Transfer Plate

    Jetson AGX Orin Reference Carrier Board

    Camera

    16 lane MIPI CSI-2 connector

    PCIe

    x16 PCIe slot supporting x8 PCIe Gen4

    RJ45

    Up to 10 GbE

    M.2 Key M

    x4 PCIe Gen 4

    USB Type-C

    2x USB 3.2 Gen2 with USB-PD support

    USB Type-A

    4x USB 3.2 Gen2

    USB Micro-B

    USB 2.0

    DisplayPort

    DisplayPort 1.4a (+MST)

    microSD slot

    UHS-1 cards up to SDR104 mode

    Other

    40-pin header (I2C, GPIO, SPI, CAN, I2S, UART, DMIC)

    12-pin automation header10-pin audio panel header

    10-pin JTAG header

    4-pin fan header

    2-pin RTC battery backup connector

    DC power jack

    Power,

    Force Recovery, and Reset buttons

    Dimensions

    110mm x 110mm x 71.65mm

    (Height includes feet, carrier board, module, and thermal solution)

     




 
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