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The NVIDIA® Jetson AGX Orin™ Developer Kit makes it easy to get started with the Jetson AGX Orin module. Compact size, lots of connectors, and up to 275 TOPS of AI performance make this developer kit perfect for prototyping advanced AI-powered robots and other autonomous machines.
Jetson AGX Orin features an NVIDIA Ampere architecture GPU together with next-generation deep learning and vision accelerators, and its high-speed IO and fast memory bandwidth can feed multiple concurrent AI application pipelines. This means you can develop solutions using your largest and most complex AI models to solve problems such as natural language understanding, 3D perception, and multi-sensor fusion.
NVIDIA JetPack™ SDK brings the NVIDIA AI software stack to Jetson, along with application development and optimization tools. Software for specific use cases is available, including Isaac™ for robotics and Metropolis for smart cities, and you can save significant time developing your AI solution when you use your datasets with TAO toolkit to fine-tune pretrained AI models from the NGC™ catalog.
Jetson ecosystem partners offer additional AI and system software, developer tools, and custom software development. They can also help with cameras and other sensors, as well as carrier boards and design services for your product.
With the computing capability of more than 8 Jetson AGX Xavier systems in a developer kit that integrates the latest NVIDIA GPU technology with the world’s most advanced deep learning software stack, you’ll have the flexibility to create tomorrow’s AI solution as well as today’s.
AI Performance | 275 TOPS (INT8) |
GPU | NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor Cores |
Max GPU Freq | 1 GHz |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
CPU Max Freq | 2 GHz |
DL Accelerator | 2x NVDLA v2.0 |
Vision Accelerator | PVA v2.0 |
Memory | 32GB 256-bit LPDDR5 204.8 GB/s |
Storage | 64GB eMMC 5.1 |
CSI Camera | Up to 6 cameras (16 via virtual channels*) 16 lanes MIPI CSI-2 D-PHY 1.2 (up to 40Gbps) | C-PHY 1.1 (up to 164Gbps) |
Video Encode | 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) |
Video Decode | 1x 8K30 | 3x 4K60 | 6x 4K30 | 12x 1080p60| 24x 1080p30 (H.265) |
UPHY | 2 x8 (or 1×8 + 2×4), 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint) 3x USB 3.2 Single lane UFS |
Networking | 1x GbE 4x 10GbE |
Display | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
Other I/O | 4x USB 2.0 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs |
Power | 15W | 30W | 60W |
Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
Camera | 16 lane MIPI CSI-2 connector |
PCIe | x16 PCIe slot supporting x8 PCIe Gen4 |
RJ45 | Up to 10 GbE |
M.2 Key M | x4 PCIe Gen 4 |
USB Type-C | 2x USB 3.2 Gen2 with USB-PD support |
USB Type-A | 4x USB 3.2 Gen2 |
USB Micro-B | USB 2.0 |
DisplayPort | DisplayPort 1.4a (+MST) |
microSD slot | UHS-1 cards up to SDR104 mode |
Other | 40-pin header (I2C, GPIO, SPI, CAN, I2S, UART, DMIC) 12-pin automation header10-pin audio panel header 10-pin JTAG header 4-pin fan header 2-pin RTC battery backup connector DC power jack Power, Force Recovery, and Reset buttons |
Dimensions | 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution) |